Two-sided circuit board 2.0 mm

Layer structure
Design rules
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Layer structure

Zweisseitige Leiterplatte - 2,0 mm

Base material thickness:        2.00    +/- 10 %
Overall thickness incl. galv. Cu and solder resist mask:        2.11    +/- 10 %

Notes on layer structure:

  • Minimum copper thicknesses in accordance with IPC 6012, current edition
  • Dependant on selected copper thickness deviating insulation thickness

Design rules for layer structuring

Through-holes [A]
(vias)


End Ø

Via pad Ø
≥ 250 µm

≥ 550 µm
Conductive pattern, outer layers
 
Standard


Conductor width with 18 µm copper base
Conductor spacing with 18 µm copper base
≥ 100 µm
≥ 120 µm
Conductor width with 35 µm copper base
Conductor spacing with 35 µm copper base
≥ 130 µm
≥ 175 µm
   Conductor width with 70 µm copper base
Conductor spacing with 70 µm copper base
≥ 190 µm
≥ 240 µm
   Conductor width with 105 µm copper base
Conductor spacing with 105 µm copper base

≥ 250 µm
≥ 320 µm

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