Pressed board thickness* | 1.48 +/- 10% |
Overall thickness incl. galv. Cu and solder resist mask* | 1.59 +/- 10% |
Through-holes [A] (vias) |
End Ø Via pad Ø |
≥ 200 µm ≥ 500 µm |
Laser blind holes [B] (blind vias) |
End Ø Via pad Ø |
≥ 100 µm ≥ 350 µm |
Core holes [C] (buried vias) |
End Ø Via pad Ø |
250 µm ≥ 550 µm |
Conductive pattern, outer layers |
||
Conductor width with 9 µm copper base Conductor spacing with 9 µm copper base |
≥ 80 µm ≥ 100 µm |
|
Standard |
Conductor width with 18 µm copper base Conductor spacing with 18 µm copper base |
≥ 100 µm ≥ 120 µm |
Conductive pattern, galvanised inner layers |
||
Conductor width with 9 µm copper base |
≥ 100 µm |
|
Standard |
Conductor width with 18 µm copper base |
≥ 115 µm |
Conductive pattern, inner layers | ||
Conductor width with 18 µm copper base Conductor spacing with 18 µm copper base |
≥ 65 µm ≥ 80 µm |
|
Standard |
Conductor width with 35 µm copper base Conductor spacing with 35 µm copper base |
≥ 85 µm ≥ 100 µm |