HF multilayer, 4 layers - 1.0 mm (laminated structure)

Layer structure
Design rules
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Layer structure

HF Multilayer 4 Lagen - 1,0 mm

Pressed board thickness *        0.94    +/- 10%
Overall thickness incl. galv. Cu and solder resist mask *        1.05    +/- 10%

Notes on layer structure:

  • * Thickness calculation with 50% copper allocation on inner layers (depending on base material type, selected copper thickness and copper allocation, deviating resultant insulation and end thicknesses)
  • Thickness tolerance of base material +/-10%
  • Minimum copper end thicknesses in accordance with IPC 6012, current edition
  • Asymmetrical mixed structure - distortion / curvature > 0.75% possible

Design rules for layer structuring

Through-holes [A]
(vias)


End Ø

Via pad Ø
≥ 150 µm

≥ 450 µm
Blind holes [B]
(mechanical blind
vias)

End Ø

Via pad Ø
≥ 300 µm

≥ 600 µm
Conductive pattern, outer layers
 
Standard


Conductor width with 18 µm copper base
Conductor spacing with 18 µm copper base

≥ 100 µm
≥ 120 µm

Conductive pattern, inner layers
Standard


Conductor width with 18 µm copper base
Conductor spacing with 18 µm copper base

≥ 65 µm
≥ 80 µm

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