HF multilayer, 6 layers - 1.5 mm (laminated structure)

Layer structure
Design rules
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Layer structure

HF Multilayer 6 Lagen - 1,5 mm

Pressed board thickness *        1.54    +/- 10%
Overall thickness incl. galv. Cu and solder resist mask *        1.65    +/- 10%

Notes on layer structure:

  • * Thickness calculation with 50% copper allocation on inner layers (depending on base material type, selected copper thickness and copper allocation, deviating resultant insulation and end thicknesses)
  • Thickness tolerance of base material +/-10%
  • Minimum copper end thicknesses in accordance with IPC 6012, current edition
  • Mixed structure - distortion / curvature > 0.75% possible

Design rules for layer structuring

Through-holes [A]
(vias)


End Ø

Via pad Ø
≥ 200 µm

≥ 500 µm
Blind holes [B]
(mechanical blind
vias)

End Ø

Via pad Ø
≥ 600 µm

≥ 900 µm
Blind holes [C ]
(mechanical blind
vias)

End Ø

Via pad Ø
≥ 300 µm

≥ 600 µm
Conductive pattern, outer layers
 
Standard


Conductor width with 18 µm copper base
Conductor spacing with  18 µm copper base

≥ 100 µm
≥ 120 µm

Conductive pattern, inner layers
Standard


Conductor width with 18 µm copper base
Conductor spacing with 18 µm copper base
≥ 65 µm
≥ 80 µm



Conductor width with 35 µm copper base
Conductor spacing with 35 µm copper base

≥ 85 µm
≥ 100 µm

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