Thick copper multilayer, 6 layers - 1.5/1.6 mm

Layer structure
Design rules
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Layer structure

Dickkupfer-Multilayer 6 Lagen - 1,55 mm

Pressed board thickness*        1,53    +/- 10%
Overall thickness incl. galv. Cu and solder resist*        1,64    +/- 10%

Notes on layer structure:

  • * Thickness calculation with filled FR-4 base material at 50% copper allocation on the inner layers (depending on base material type, selected copper thickness and copper allocation, deviating resultant insulation and end thicknesses)
  • Thickness tolerance of base material +/-10%
  • Minimum copper end thicknesses in accordance with IPC 6012, current edition

Design rules for layer structuring

Through-holes [A]
(vias)
End-Ø

Viapad-Ø
≥ 350 µm

≥ 800 µm
Conductive pattern, outer layers  
Conductor width with 50 µm copper base
Conductor spacing with 50 µm copper base
≥ 160 µm
≥ 215 µm
Standard Conductor width with 70 µm copper base
Conductor spacing with 70 µm copper base
≥ 200 µm
≥ 260 µm

Conductor width with 105 µm copper base
Conductor spacing with 105 µm copper base

≥ 250 µm
≥ 320 µm
Conductive pattern, inner layers
Conductor width with 70 µm copper base
Conductor spacing with 70 µm copper base
≥ 170 µm
≥ 170 µm
Standard Conductor width with 105 µm copper base
Conductor spacing with 105 µm copper base
≥ 210 µm
≥ 220 µm

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