Thick copper multilayer, 4 layers - 2.0 mm

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Layer structure

Layer structure

Dickkupfer-Multilayer 4 Lagen - 2,0 mm

Pressed board thickness*	2.05 +/- 10%
Overall thickness incl. galv. Cu and solder resist mask*	2.16 +/- 10%

Notes on layer structure:

* Thickness calculation with filled FR-4 base material at 50% copper allocation on the inner layers (depending on base material type, selected copper thickness and copper allocation, deviating resultant insulation and end thicknesses)
Thickness tolerance of base material +/-10%
Minimum copper end thicknesses in accordance with IPC 6012, current edition

Design rules for layer structuring

Through-holes [A] (vias)	End Ø Via pad Ø	≥ 250 µm ≥ 700 µm
Conductive pattern, outer layers
	Conductor width with 50 µm copper base Conductor spacing with 50 µm copper base	≥ 160 µm ≥ 215 µm
Standard	Conductor width with 70 µm copper base Conductor spacing with 70 µm copper base	≥ 200 µm ≥ 260 µm
	Conductor width with 105 µm copper base Conductor spacing with 105 µm copper base	≥ 250 µm ≥ 320 µm
Conductive pattern, inner layers
	Conductor width with 70 µm copper base Conductor spacing with 70 µm copper base	≥ 145 µm ≥ 150 µm
Standard	Conductor width with 105 µm copper base Conductor spacing with 105 µm copper base	≥ 175 µm ≥ 190 µm

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