Pressed board thickness* | 2.05 +/- 10% |
Overall thickness incl. galv. Cu and solder resist mask* | 2.16 +/- 10% |
Through-holes [A] (vias) |
End Ø Via pad Ø |
≥ 250 µm ≥ 700 µm |
Conductive pattern, outer layers |
||
Conductor width with 50 µm copper base Conductor spacing with 50 µm copper base |
≥ 160 µm ≥ 215 µm |
|
Standard |
Conductor width with 70 µm copper base Conductor spacing with 70 µm copper base |
≥ 200 µm ≥ 260 µm |
Conductor width with 105 µm copper base |
≥ 250 µm |
|
Conductive pattern, inner layers | ||
Conductor width with 70 µm copper base Conductor spacing with 70 µm copper base |
≥ 145 µm ≥ 150 µm |
|
Standard |
Conductor width with 105 µm copper base Conductor spacing with 105 µm copper base |
≥ 175 µm ≥ 190 µm |