Thick copper multilayer, 6 layers - 2.4 mm

Layer structure
Design rules
Downloads

Layer structure

Dickkupfer-Multilayer 6 Lagen - 2,4 mm

Pressed board thickness*        2.35    +/- 10%
Overall thickness incl. galv. Cu and solder resist mask*        2.46    +/- 10%

Notes on layer structure:

  • * Thickness calculation with filled FR-4 base material at 50% copper allocation on the inner layers (depending on base material type, selected copper thickness and copper allocation, deviating resultant insulation and end thicknesses)
  • Thickness tolerance of base material +/-10%
  • Minimum copper end thicknesses in accordance with IPC 6012, current edition

Design rules for layer structuring

Through-holes [A]
(vias)


End Ø

Via pad Ø
≥ 350 µm

≥ 800 µm
Conductive pattern, outer layers
 
Conductor width with 50 µm copper base
Conductor spacing with 50 µm copper base
≥ 160 µm
≥ 215 µm
Standard


Conductor width with 70 µm copper base
Conductor spacing with 70 µm copper base
≥ 200 µm
≥ 260 µm
 

Conductor width with 105 µm copper base
Conductor spacing with 105 µm copper base

≥ 250 µm
≥ 320 µm

Conductive pattern, inner layers



Conductor width with 70 µm copper base
Conductor spacing with 70 µm copper base
≥ 145 µm
≥ 150 µm
Standard


Conductor width with 105 µm copper base
Conductor spacing with 105 µm copper base

≥ 175 µm
≥ 190 µm



Downloads

Download PDF