Two-sided circuit board 0.3 mm

Layer structure
Design rules
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Layer structure

Zweisseitige Leiterplatte - 0,3 mm

Base material thickness:        0.29    +/- 10 %
Overall thickness incl. galv. Cu and solder resist mask:        0.40    +/- 10 %

Notes on layer structure:

  • Minimum copper thicknesses in accordance with IPC 6012, current edition

Design rules for layer structuring

Through-holes [A]
(vias)


End Ø

Via pad Ø
≥ 150 µm

≥ 450 µm
Conductive pattern, outer layers
 
Standard


Conductor width with 18 µm copper base
Conductor spacing with 18 µm copper base
≥ 100 µm
≥ 120 µm
Conductor width with 35 µm copper base
Conductor spacing with 35 µm copper base

≥ 130 µm
≥ 175 µm

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