Multilayer, 12 layers - 3.2 mm

Layer structure
Design rules
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Layer structure

Multilayer 12 Lagen - 3,2 mm

Pressed board thickness *        3.08    +/- 10%
Overall thickness incl. galv. Cu and solder resist mask *        3.19    +/- 10%

Notes on layer structure:

  • * Thickness calculation with unfilled FR-4 base material at 50% copper allocation on the inner layers (depending on base material type, selected copper thickness and copper allocation, deviating resultant insulation and end thicknesses)
  • Thickness tolerance of base material +/-10%
  • Minimum copper end thicknesses in accordance with IPC 6012, current edition

Design rules for layer structuring

Through-holes [A]
(vias)


End Ø

Via pad Ø
≥ 400 µm

≥ 700 µm
Conductive pattern, outer layers
 
Conductor width with 9 µm copper base
Conductor spacing with 9 µm copper base
≥ 80 µm
≥ 100 µm
Standard


Conductor width with 18 µm copper base
Conductor spacing with 18 µm copper base
≥ 100 µm
≥ 120 µm
Conductor width with 35 µm copper base
Conductor spacing with 35 µm copper base
≥ 130 µm
≥ 175 µm
Conductor width with 70 µm copper base
Conductor spacing with 70 µm copper base

≥ 190 µm
≥ 240 µm

Conductive pattern, inner layers



Conductor width with 18 µm copper base
Conductor spacing with 18 µm copper base
≥ 65 µm
≥ 80 µm
Standard


Conductor width with 35 µm copper base
Conductor spacing with 35 µm copper base

≥ 85 µm
≥ 100 µm

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