Focus of research and development activities

Integration of functionalities in the circuit board

Vertical integration is opening up new horizons in the design of electronic modules. That is because circuit carriers with embedded electronic components are capable of much more than merely securing components and connecting these together conductively.

The gain in area for the securing of components, improved heat dissipation, more economical HF characteristics or the possibility of system integration are just a few of the advantages that can be achieved with device embedded substrates.

KSG is currently focusing its activities on the integration of passive and active components (embedded components) in three integration technologies.

Cavity technology

Production of cavities by means of mechanical depth milling or a combination of mechanical depth milling and laser removal.

Eingebetteter Schalter (MEMS)

Embedded switch (MEMS)

Eingebetteter Inertialsensor (MEMS)

Embedded inertial sensor (MEMS) and ASIC

"Embedding" of passive /active components by pressing a component-populated inner layer in the multilayer composite by means of:

Pad bonding technology


Press bonding a component-populated and soldered inner layer. The electrical contact is made by soldering. An interconnection of the component connections is necessary.

Via connection technology


Press bonding a component-populated and soldered inner layer. The electrical contact is made by means of metallised laser vias directly onto the component connections. An interconnection can thereby be dispensed with.

Resistors, capacitors and inductances can nowadays be integrated into the circuit board interior as discrete components. By means of conventional structuring and connection technologies such as soldering or conductive gluing these are contacted on an inner layer or secured in cavities and tethered directly by means of vias.

In the circuit board composite, embedded capacitors (see Fig.) exhibit many advantages. In comparison to their surface mountable pendants, the parasitic inductances are significantly less and the capacitors can be brought spatially closer to the IC connections.

Further advantages of these technologies:

  • Substitute for board-to-board assemblies
  • Assembly miniaturisation
  • Touch protection
  • Housing substitute
  • Piracy protection
  • Improved heat management
  • EMC protection (Faraday cage)
  • Protection against environmental influences (air humidity, pressure, vibration, impact etc.)